From the Top,Down
State-of-the-art schematic capture and simulation tools allow you to take a hierarchical approach to the design space. SYNPLE provides a large multi-domain library of electrical, mechanical, thermal, and MEMS libraries. These elements may be combined in an effortless drag-and-drop fashion and then wired to create schematics of multi-domain systems. As a result, you can quickly survey a large design space before initiating a detailed analysis and verification process. Users can perform device level optimization using Design of Experiments (DoE), Robust Design or other techniques.
Mask and Hex Mesh Synthesis tools
Built in place and route and synthesis algorithms can be then used to convert the schematic into a mask layout or an optimally hexahedral meshed model ready for full 3d analysis.
From the Bottom, Up
IntelliSuite¡¯s bottom up architecture is based upon process elements familiar process steps, such as photolithography, thin film deposition, selective etching form the basis of understanding the final device geometries. By systematically building the prototype in IntelliSuite, you can identify costly process bugs before entering the fab, which ultimately saves time and money. The process steps, combined with the mask geometries, can be used to build the final virtual device.
Blueprint, an advanced layout and TapeOut all angle Physical Verification (DRC) tools allow you to layout complex masks with ease. Automated hexahedral meshing techniques can be used to construct robust meshes for analysis.
Real-world connections
IntelliSuite features a comprehensive material database, which allows you to understand material properties like conductivity, film stresses and mechanicall strength as a function of processing parameters. Subsequently, this enables you to produce more realistic models.
Etching has always been a bugbear in MEMS technology. We¡¯ve provide wet and dry etch simulators ¡ª a full anisotropic wet etch simulator for creating realistic models of your KOH, TMAH or EDP etches, and a dry etch simulator for simulating RIE/ICP and Bosch etch processes.
Fastfield Multiphysics
IntelliSuite comes with all the modules that you need to perform fully coupled thermal, electrostatic, fluidic and mechanical simulation and piezo simulation of the MEMS device. Optional modules for electromagnetic and fluidic/bioMEMS analysis are available. Out of the box, you can analyze almost any MEMS device that you can dream up! The IntelliSuite virtual device can be subjected to a combination of inputs, such as electrostatics, electromagnetic fields, temperature, mechanical stresses and pressures, and fluid flow.
Compact Model Extraction
IntelliSuite uses state-of-the-art model reduction techniques to automatically create compact system models from large finite element models. System models encompass coupled electro-mechanical behavior including stress stiffening, electrostatic softening, packaging effects, fluidic and other sources of damping. These accurate compact models can be exported to VHDL, Verilog-A, SPICE, Matlab and other tools for full MEMS-ASIC co-simulation.
Open system
IntelliSuite is designed to be an open system that¡¯s compatible with other tools. We speak a wide range of file formats, including DXF and GDS II (for mask import and export), IGES and PATRAN (solid model or FEA input), ABAQUS, ANSYS (FEA model import and export) and Touchstone (high-frequency analysis). Our macro-models can be used in conjunction with H-SPICE, SPECTRE, HFSS, ADMS, ELDO, Matlab/Simulink, SystemVision or other VHDL-AMS, Verilog-A or SPICE based tools for further system integration. All of the analysis results and solid models can be exported to AVI or JPG format to enhance your next presentation or report. In addition, all of our file formats are rigorously documented and available, which means that, like other tools on the market, vendor lock-in is never an issue.