Custom fabrication and supply chain management

IntelliSense has formed strong affiliations with established MEMS foundries and research institutions throughout the United States and the world. Our partnerships through out the value chain allow IntelliSense to prototype and transfer MEMS based components into production at the lowest cost.

Prototype to manufacturing

It is important for custom MEMS design that design and process development engineers work closely together. That is why IntelliSense has formed strategic partnerships with the leading MEMS foundries. Prototype development, including packaging and test, is done with these partners. Pilot-line manufacturing can be completed with these local foundries as well. To reduce cost, higher volume manufacturing can be done in our overseas manufacturing partners¡¯ facilities.

Packaging services

The cost of packaging can range from 30 to 95 percent of the final cost of a device. We can help you drive down MEMS, BioMEMS and MOEMS packaging costs, reduce your risk in the development cycle, and smooth the path through pilot scale to high-volume manufacturing. This is done through packaging  simulation using are own CAD software IntelliSuite (Packaging Analysis Module, MEMaterial, IntelliFab). Various analyses (thermal, stress/strain, deformation, high frequency, vibrational, etc.) performed can reduce the number of prototyping cycles usually required. Plus, our foundry partner¡¯s extensive electronic and optoelectronic packaging assembly capabilities provide the proper working environment and critical interfaces between a device and the macroscopic world.

Reducing risk

Our strategic parnetships gives you access to the right vendor for the right job. By working with several vendors, we closely keep track of their evolving expertise and competence in different areas. This allows us to put together the right partnerships to get your devices to market quicker.

Fabrication capability

 Bulk micromachining
 Surface micromachining
 SOI-MEMS
 Electroplated MEMS
 CMOS-MEMS integration

 IntelliSense Fabrication Platform 
 IntelliSense Test Platform 
 IntelliSense Wet Etching Platform 
 IntelliSense DRIE Calibration Tool 

Packaging capability
 Micro-assembly
 Wafer scale packaging
 Substrate singulation
 High volume pick and place
 Fiber attach and pigtailing
 Interconnect and flip chip
 Active optical benches
 Package sealing
 Custom packaging

Foundry services

 Foundry services brochure 
 Packaging services brochure